Объявлен конкурс на присоединение новых партнеров к проекту SEA-NET
Объявлен конкурс на присоединение новых партнеров к проекту SEA-NET, www.sea-net.info. Это интегрированный проект, который финансируется по разделу 6РП «Технологии информационного общества». Новые партнеры нужны для оценки прототипов оборудования и новых элементов, расширяющих возможности существующего оборудования, а также для их использования в полупроводниковых технологиях следующего поколения. Конкурс открыт до 29 августа 2007 г.
Подробнее:
Project title: SEA-NET Competitive call
The IST Integrated project SEA NET is looking for additional sub-projects / partners for the assessment of prototype equipment and novel enhancements to existing equipment, and their application to next generation semiconductor technologies and device architectures.
The main objective of the SEA-NET project is to validate emerging semiconductor manufacturing equipment for advanced process requirements for the 65 nm, 45 nm, 32 nm and 22 nm technology nodes, together with the necessary advances in equipment, materials and production control for both standard and new Nanoelectronic CMOS architectures.
The main themes applicable for becoming an assessment sub-project in SEA-NET include:
- Processing: Advanced Substrate Materials, Dopant /Control, Dielectric Isolation / Gate Structures, Barriers / Multilayer Interconnect.
- Metrology and analytics: with capability to accurately measure the key parameters of these layers/multilayers, particularly within automated production lines.
- Automated handling and cleaning equipment
- Methodologies that can impact the emergence of broader functionality integration using System on Chip (SoC) or System in Package (SiP).
The additional assessment sub-projects will be supported by joint R&D activities to foster a SEA-NET specific certification procedure for APC capabilities and to shorten yield learning cycles by predicting the yield of the currently processed wafers. Joint assessment metrics and a unified assessment approach are available.
The new sub-projects should consist at least of one equipment supplier, one user (semiconductor manufacturer) and one R&D organisation.
Deadline: The call closes at 17h00 (time in Erlangen, Germany) on 29th August 2007.
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